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Lightweight Modular Pod System

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-17-C-0323
Agency Tracking Number: N17A-007-0016
Amount: $124,881.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N17A-T007
Solicitation Number: 2017.0
Timeline
Solicitation Year: 2017
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-05-09
Award End Date (Contract End Date): 2017-11-30
Small Business Information
1850 Frankfurst Avenue
Baltimore, MD 21226
United States
DUNS: 188955991
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Philip Daigle
 Senior Engineer
 (207) 837-6175
 phil_daigle@mapcorp.com
Business Contact
 Peter MacShane
Phone: (443) 524-3330
Email: macs@mapcorp.com
Research Institution
 University of Maine
 Michael Hastings
 (207) 581-1484
 Nonprofit College or University
Abstract

MAPC proposes a Light Weight Modular Pod System (LMPODS) which accommodates multiple sensor packages of varying configurations. With subcontractor The University of Maine, MAPC will analyze and qualify the LMPODS for the maximum required sensor weight and a range of centers of gravity, thus allowing future sensor systems to be installed into the LMPODS without requiring lengthy and expensive re-qualification. The LMPODS is composed of a removable and configurable sensor mounting rack, which provides structural support, airflow ducting interfaces, and electrical connector interfaces for the sensors. The mounting rack interfaces with integral rails on the external aluminum shell. The external shell includes removable nose (fwd) and tail (aft) nacelles for access to the forward sensors and the aft section, which houses the Environmental Control Unit (ECU). The LMPODS ECU will maintain the internal temperature to 65 +/- 5F. The external shell includes removable panels for accessing the sensors for maintenance.The LMPODS includes a reinforced structural plate designed for attachment to the BRU-14A. The plate includes vibration dampening pads which isolate the sensor package from aircraft induced vibrations.

* Information listed above is at the time of submission. *

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