Rapid Hole Array Drilling Using Laser and Mechanical Processes

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,703.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
F29601-02-C-0122
Award Id:
57398
Agency Tracking Number:
021NM-0468
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
205 Williamson Square, Franklin, TN, 37064
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
016551561
Principal Investigator:
Jeffrey Paine
Chief Manager
(615) 595-6665
jpaine@dynamic-structures.com
Business Contact:
Jeffrey Paine
Chief Manager
(615) 595-6665
dsm@dynamic-structures.com
Research Institution:
n/a
Abstract
"An innovative solution is proposed for production of precise hole arrays in metals and other materials. To create arrays of holes on the order of 0.1 to 0.5 mm diameter and 0.5 to 5 mm deep, DSM proposes a combination of high peak-power lasers and veryprecise and accurate part manipulation. "Pico and femto-second" lasers with very short pulse duration and very high rep-rates produce streams of high intensity energy pulses that excel at micro-drilling of metals. A critical requirement for precisedrilling and cutting is the avoidance of heat dissipation and the loss of concentrated energy at the ablation site. With the ability to deposit the energy at very short intervals and high rep-rates, heat dissipation can be minimized. By attempting theprecise drilling of sample materials with a number of laser sources, an effective combination of laser wavelength, pulse duration and rep-rate will be determined. A novel part handling and precision manipulation platform will be used to achieve precisedrilling control and correct for any laser beam quality errors (taper and/or non-circularity errors). Finally, Phase I will demonstrate the ability to rapidly position and process the part to achieve desired hole production throughput. Precisionmicro-machining and micro-processing of materials is an increasingly important tool for the production of MEMS, biomedical devices, photonics components, and precision apertures. The ability to accurate

* information listed above is at the time of submission.

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