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Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent Components
Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-16-M-2709
Agency Tracking Number: F16A-T17-0043
Amount:
$149,982.00
Phase:
Phase I
Program:
STTR
Solicitation Topic Code:
AF16-AT17
Solicitation Number:
2016.0
Timeline
Solicitation Year:
2016
Award Year:
2016
Award Start Date (Proposal Award Date):
2016-06-29
Award End Date (Contract End Date):
2017-03-30
Small Business Information
4775 Centennial Boulevard, Suite 130
Colorado Springs, CO
80919
United States
DUNS:
619085371
HUBZone Owned:
No
Woman Owned:
No
Socially and Economically Disadvantaged:
No
Principal Investigator
Name: Mr. Stephen Philpy
Phone: (719) 531-0805
Email: stephen.philpy@micro-rdc.com
Phone: (719) 531-0805
Email: stephen.philpy@micro-rdc.com
Business Contact
Name: Ms. Karen Van Cura
Phone: (719) 531-0805
Email: karen.vancura@micro-rdc.com
Phone: (719) 531-0805
Email: karen.vancura@micro-rdc.com
Research Institution
Name: Tennesse Technological University
Contact: Dr. Wayne Johnson
Address:
Phone: (931) 372-3397
Type: Nonprofit College or University
Contact: Dr. Wayne Johnson
Address:
1 William Jones Drive
Array
Cookeville, TN
38505
United States
Phone: (931) 372-3397
Type: Nonprofit College or University
Abstract
Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...
* Information listed above is at the time of submission. *
