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Solid-state, Conformal Laser Enclosure Cooling System

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-18-C-0545
Agency Tracking Number: N18A-001-0167
Amount: $129,999.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N18A-T001
Solicitation Number: 2018.0
Solicitation Year: 2018
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-05-31
Award End Date (Contract End Date): 2018-12-03
Small Business Information
6201 East Oltorf St.
Austin, TX 78741
United States
DUNS: 100651798
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Giri Joshi
 (512) 389-9990
Business Contact
 Michael Mayo
Phone: (512) 389-9990
Research Institution
 University of Virginia
 University of Virginia
1001 North Emmet Street PO Box 400195
Charlottesville, VA 22904
United States

 (434) 297-7402
 Nonprofit college or university

The Thermoelectric coolers (TECs) are solid-state devices with no moving parts that provide reliable cooling power compared to traditional cooling systems such as vacuum compressors. However, their relatively high cost and low coefficient of performance (~ 0.5) have relegated them to niche applications such as small-scale portable coolers and, have yet, to be competitive from an efficiency standpoint with large-volume conventional cooling technologies. Recent improvements in TE device performance along with novel architectures in the form of a large-area, conformal TEC provide a means to manufacture larger-size spread coolers that can transfer significantly more heat (~ kW) with higher efficiency (COP~2.0) at a reduced cost compared to the tiling of rigid, ceramic-plate TECs. The novel TEC design can cool 2 kW of heat from a laser enclosure and permit the laser head temperature to be maintained at 10C and an enclosure temperature at 25C. Large-area conformal, solid-state TEC devices will be more reliable and consistent compared to conventional cooling systems such as vacuum compressors and Rankine coolers.

* Information listed above is at the time of submission. *

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