HIGH-TC SUPERCONDUCTING COMPOSITES FOR INTERCONNECTS TO CRYOGENIC EQUIPMENT

Award Information
Agency:
National Aeronautics and Space Administration
Branch:
N/A
Amount:
$499,999.00
Award Year:
1992
Program:
SBIR
Phase:
Phase II
Contract:
N/A
Agency Tracking Number:
16927
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Eic Laboratory, Inc.
111 Downey St, Norwood, MA, 02062
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 () -
Business Contact
Phone: () -
Research Institution
N/A
Abstract
A VACUUM-DEPOSITION PROCESS THAT PROMOTES CRYSTAL-LOGRAPHIC ORIENTATION AND HIGH CRITICAL CURRENTS IN YBA2CU3O7-X FILMS DEPOSITED ON CERAMIC SUBSTRATES WILL BE DEVELOPED AS A MEANS OF FABRICATING FLEXIBLE ELECTRICAL INTERCONNECTS TO CRYOGENIC EQUIPMENT IN THE SPACE ENVIRONMENT. THE INTERCONNECTS WILL COMPRISE A THIN FILM OF HIGH-JC YBA2CU3O7-X, DEPOSITED ONTO FLEXIBLE CERAMIC TAPES AND FILAMENTS, A BUFFER LAYER, A VACUUM- DEPOSITED OXIDE OVERLAYER, AND A LOW OUT-GASSING, POLYMER ENCAPSULANT. METHODS FOR REDUCING BOTH CONDUCTIVE- AND RADIANT- HEAT TRANSFER ARE INCORPORATED INTO THE DESIGN. THE INTERCONNECTS WOULD HAVE SIGNIFICANTLY LOWER THERMAL CONDUCTIVITY, NO I2R LOSSES (FOR DC APPLICATIONS), AND WOULDBE OF EQUIVALENT OR LOWER WEIGHT THAN CONVENTIONAL METAL INTERCONNECTS. THE LOW THERMAL CONDUCTIVITY WILL MINIMIZE CRYOGEN (PRIMARY LIQUID-HELIUM) LOSS AND SIGNIFICANTLY INCREASE THE MISSION-LIFE OF SENSORS AND OTHER EQUIPMENT REQUIRING CRYOGENIC COOLING. THE PRINCIPAL TECHNICAL OBJECTIVE OF THE PHASE I PROGRAM IS TO DEMONSTRATE THE DEPOSITION OF HIGH-JC YBA2CU3O7-X (JC-10(6) A/CM(2) AT 77 K) ON FLEXIBLE TAPES AND FILAMENTS WITH AN IC OF 20 A AT 77 K). A VACUUM-DEPOSITION PROCESS THAT PROMOTES CRYSTAL-LOGRAPHIC ORIENTATION AND HIGH CRITICAL CURRENTS IN YBA2CU3O7-X FILMS DEPOSITED ON CERAMIC SUBSTRATES WILL BE DEVELOPED AS A MEANS OF FABRICATING FLEXIBLE ELECTRICAL INTERCONNECTS TO CRYOGENIC EQUIPMENT IN THE SPACE ENVIRONMENT. THE INTERCONNECTS WILL COMPRISE A THIN FILM OF HIGH-JC YBA2CU3O7-X, DEPOSITED ONTO FLEXIBLE CERAMIC TAPES AND FILAMENTS, A BUFFER LAYER, A VACUUM- DEPOSITED OXIDE OVERLAYER, AND A LOW OUT-GASSING, POLYMER ENCAPSULANT. METHODS FOR REDUCING BOTH CONDUCTIVE- AND RADIANT- HEAT TRANSFER ARE INCORPORATED INTO THE DESIGN. THE INTERCONNECTS WOULD HAVE SIGNIFICANTLY LOWER THERMAL CONDUCTIVITY, NO I2R LOSSES (FOR DC APPLICATIONS), AND WOULDBE OF EQUIVALENT OR LOWER WEIGHT THAN CONVENTIONAL METAL INTERCONNECTS. THE LOW THERMAL CONDUCTIVITY WILL MINIMIZE CRYOGEN (PRIMARY LIQUID-HELIUM) LOSS AND SIGNIFICANTLY INCREASE THE MISSION-LIFE OF SENSORS AND OTHER EQUIPMENT REQUIRING CRYOGENIC COOLING. THE PRINCIPAL TECHNICAL OBJECTIVE OF THE PHASE I PROGRAM IS TO DEMONSTRATE THE DEPOSITION OF HIGH-JC YBA2CU3O7-X (JC-10(6) A/CM(2) AT 77 K) ON FLEXIBLE TAPES AND FILAMENTS WITH AN IC OF 20 A AT 77 K).

* information listed above is at the time of submission.

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