Low-Shock Release Mechanism with Structural Function

Award Information
Agency:
Department of Defense
Branch:
Missile Defense Agency
Amount:
$69,974.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
F29601-02-C-0199
Agency Tracking Number:
02-0701
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Eic Laboratories, Inc.
111 Downey Street, Norwood, MA, 02062
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
076603836
Principal Investigator
 Michael Gilbert
 Senior Scientist
 (781) 769-9450
 gilbert@eiclabs.com
Business Contact
 R. David Rauh
Title: President
Phone: (781) 769-9450
Email: drauh@eiclabs.com
Research Institution
N/A
Abstract
"The development of a multi-functional system for release or jettisoning of structures on launch vehicles and spacecraft is proposed. The system acts as both a release mechanism and as a structural component of an assembly prior to release. The primaryinnovation is the use of a high-strength adhesive, recently developed at EIC Laboratories, that is rapidly disbonded from a metallic surface by the application of a low-current voltage to the adhesive-substrate bondline. This electrically disbondingfunction allows the design of delatching and deployment mechanisms that consume very little power and avoids the extensive use of pyrotechnics or other high-energy sources for separating mechanical components. Advantages of the system include: reducedvibration, shock, and pyrotechnic contamination when jettisoning large structures such as fairings; reduced weight, volume and power consumption relative to paraffin-based or shape-memory-alloy thermal or motor-driven delatching mechanisms; and greaterflexibility in the design of space structures and launch vehicles. In Phase I, a low-outgassing version of the adhesive will be developed and incorporated into release mechanisms. The functional performance of the release mechanisms will be evaluated andthe pre-launch, launch, and space-environment stability and disbonding properties of the adhesive determined. Commercial applications in DoD, NASA and commercial launch vehicles and satellites are ant

* information listed above is at the time of submission.

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