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Innovative Armor Fastening Technology (s) for Tactical Vehicles of the Current and the Future Force

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-06-C-0093
Agency Tracking Number: A052-244-1120
Amount: $69,981.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A05-244
Solicitation Number: 2005.2
Solicitation Year: 2005
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-11-14
Award End Date (Contract End Date): 2006-05-14
Small Business Information
111 Downey Street
Norwood, MA 02062
United States
DUNS: 076603836
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Michael Gilbert
 Senior Scientist
 (781) 769-9450
Business Contact
 R. Rauh
Title: President
Phone: (781) 769-9450
Research Institution

Electrically releasing adhesives are proposed as innovative fasteners for attaching modular armor to military vehicles. Bonds formed with these adhesives will provide durable, high strength (>2000 psi shear), mechanically robust attachments, that can be rapidly released, on-demand by the application of a low power current (10-50 volts d.c., <0.5 watts/square inch). Combination of these attachments with an internal spring mechanism results in the formation of a remote release device that can be used to pop-off individual tiles of armor when desired. The proposed fasten and release system is lightweight, inexpensive and highly conformable. It can be used to join a wide variety of dissimilar materials including metals, ceramics and polymer composites and it is readily adaptable to any size or shape of armor used. In the phase I, concepts for model armor tile release devices will be evaluated. These devices will allow rapid ejection of the tile from a remote location and rapid reattachment of replacements under field conditions. Novel electrically releasing adhesives will be formulated to meet these challenges. Bond strengths to various substrates will be measured and environmental durability will be assessed.

* Information listed above is at the time of submission. *

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