INTEGRATED CIRCUIT DEVICE PACKAGING PROTECTION AGAINST HIGH POWER MICROWAVE DIRECTED ENERGY WEAPONS

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 15734
Amount: $49,378.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1991
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
Po Box 260263, Denver, CO, 80226
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dale Steffen
 Principal Investigator
 (303) 980-0070
Business Contact
Phone: () -
Research Institution
N/A
Abstract
HIGH POWER MICROWAVE (HPM) DIRECTED ENERGY WEAPONS POSE A THREAT TO SYSTEMS WHICH EMPLOY ADVANCED INTEGRATED CIRCUITS (VLSI/VHSIC). THESE CIRCUITS, WHICH USE SMALL GEOMETRY DEVICES, ARE SUSCEPTIBLE TO UPSET AND DAMAGE DUE TO THE LARGE CURRENTS AND VOLTAGES WHICH COUPLE TO THE PRINTED CIRCUIT BOARDS FROM HPM SOURCES. ELECTROSTATIC DISCHARGE PROTECTION IS INADEQUATE FOR THE REPETITIVE PULSE NATURE OF THE HPM THREAT, AND EXISTING TERMINAL PROTECTION DEVICES ARE TOO BULKY TO BE INCORPORATED INTO THE IC PACKAGES. THIS PROPOSAL ADDRESSES THE PROBLEM OF HARDENING THE PACKAGES THROUGH USE OF MICROWAVE FILTERING WITH FERRITE MATERIALS AND MICROWAVE TRANSMISSION LINES, AS WELL AS THE USE OF METALIZED DIELECTRIC COATINGS. THE APPROACH IS TO COMBINE MULTIPLE APPROACHES FOR HARDENING TO ACHIEVE INCRESED ATTENUATION AND PROTECT AGAINST A BROADER HAND OF FREQUENCIES. THREE DIMENAIONAL FINITE DIFFERENCE MODELING OF THE PRINTED CIRCUIT BOARDS AND IC PACKAGE WILL BE USED TO DETERMINE THREAT LEVELS AT THE CHIP INPUTS AND TO DETERMINE THE EFFECTIVENESS OF THE PROTECTION MEASURES.

* Information listed above is at the time of submission. *

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