A NOVEL 3-DIMENSIONAL CHIP CONNECTION SYSTEM USING TRENCH FILLED METALLIC PLUGS

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$46,226.00
Award Year:
1992
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
17948
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Electro-optek Corp.
3152 Kashiwa Street, Torrance, CA, 90505
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
William S. Chan
(310) 534-3666
Business Contact:
() -
Research Institution:
n/a
Abstract
CONVENTIONAL TWO-DIMENSIOANL INTEGRATED CIRCUITS DESPITE THEIR CONSPICUOUS PROGRESS IN SUBMICRON DOMAIN HAVE ALMOST REACHED THEIR LIMITS IN PACKING DENSITY. ONE WAY TO ACHIEVE A HIGH LEVEL OF INTEGRATION IS TO STACK THE CIRCUIT LAYERS VERTICALLY TO RESULT IN A THREE-DIMENSIOANL CHIP SYSTEM ELECTRO-OPTEK PROPOSED TO DEVELOP AN INNOVATIVE THREE-DIMENSIONAL CHIP CONNECTION SYSTEM FOR FABRICATING HYPER DENSE CHIPS. THE ARCHITECTURE INVOLVE STAKING A MULTIPLE LAYERS OF PROCESSED MICROCIUCUITS UTILIZING SPECIALIZED THRENCH FILLED METALLIC PLUGS AND WAFER THINNING PROCEDURES TO FORM A THREE DIMENSIONAL STRUCUTRE SUCH THAT EACH LAYER WILL HAVE A CIRUCUIT WHICH MAY BE TESTED INDEPENDENTLY WHITHOUT AFFECTING THE OTHER LAYERS. IN THIS PROGRMA, WE WILL USE ESTALISHED TECHNOLOGIES OF MICRO-MACHINING AND MICROELECTRONIC PROCESSING OF SILICON (SI) WAFERS TO FABRICATE THESE CIRCUIT LAYERS AND THE THREE-DIMENSIOANL ARCHITECUTRE. THE RESULTANT THREE-DIMENSIOANL CHIP WILL POCESS FEATURES OF VERY HIGH PACKING DENSITY LEADING TO ULTRA-LARGE-SCALE-INTEGRAITON (ULSI) AND HIGH SPEED TO VERICLA INTERCONNECTIONS ASSOCIATED WITH SHORTER LENGHTS THUS MAKING THEM IDEAL FOR MASSIVELY PARALLEL AND HIGH SPEED SIGNAL PROCESSING APPLICATIONS. THE REULTANT STURCTURES WILL ALSO BE REDIATION-HARD AND WILL BE IMMUNE TO TOAL DOSE AND SINGLE-EVENT UPSET RATES DUE TO THINNER ACTIVE CIRUIT LAYERS AND THE RESULTANT SMALLER ACTIVE VOLUMES.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government