Electroformed High Resolution Thick Metal Film for Hyper-Dense Electronic Packaging

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 18054
Amount: $300,000.00
Phase: Phase II
Program: SBIR
Awards Year: 1993
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
118 Sherwood Road, Ridgewood, NJ, 07450
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Igor V. Kadija
 (201) 670-8397
Business Contact
Phone: () -
Research Institution
20 microns thick metal film deposits at thin film resolutions will ensure densely integrated MCMs essential to advanced electronic devices such as onboard data and signal processing systems (OBDP). 99.8% dense and 99.8% pure monolithic and environmentally stable copper interconnects in analog applications will remove heat and control impedance with 5-10 times capacity. Two to three times higher chip density in digital MCMs will reduce signal amplitude losses, signal ground bounce and clock distribution variation. As digital clock speeds increase, power and ground line impedance can limit dynamic and static noise margins. Compared to conventional devices, ECSI interconnects will extend this limit two to three times. ECSI's proprietary technology will deliver superior products at high yields at reduced cost.

* Information listed above is at the time of submission. *

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