Direct Electroplating Of Interconnects - An Efficient New Technology For Advanced MCMS

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$52,000.00
Award Year:
1993
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
19758
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Electrochemical Systems, Inc.
118 Sherwood Road, Ridgewood, NJ, 07450
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Igor Kadija
(201) 670-8397
Business Contact:
() -
Research Institution:
n/a
Abstract
This proposed development will result in the first production process for direct electroplating of copper interconnects for microelectronics manufacturing. Technology for direct electroplating processes will be developed. The direct electroplating of interconnects with the ECSI proprietary process produces the highest attainable interconnect conductance. The ECSI process does not need the conventional conducting metalization for cathode current return. By eliminating the need for a common current collector the process significantly simplifies design and manufacturability. Also, this process reduces the importance of current thieves in the plating geometry and in many cases the thieves are potentially eliminated. As a result packaging density can be increased. The elimination of the common current collector connections makes many electroforming applications feasible that otherwise are impossible. The major technology, demonstrations and development milestones are: (1) Establish process for direct electroplate activation of substate (e.g., utilize the Black Hole (TM) technology by MacDermid, Conductron DP(TM) by LeaRonal or other process) reqired for direct electroplating of interconnects. (2) Direct electroplate high density, 10 to 100 micrometer lines and vias on silicon, ceramic and organic substrates. (3) Apply direct electroplating technique with nickel and gold or other metals for interconnects metal finishing. (4) Develop plan to demonstrate the utility of this capability in collaboration with an end user. (5) Prepare business plan to ensure commercail availability of manufacturing equipment. ANTICIPATED BENEFITS: This technology will have its largest market in multichip modules MCMs. Multichip modules are increasingly being designed into military systems. Next generation computer workstations will utilize more MCMs and Supercomputer manufacturers including Cray and IBM. Direct eletroplating of interconnects by this efficient ECSI process will play an important role in resolving structural and technological, and by reducing non-recurring engineering costs associated with introducing new designs.

* information listed above is at the time of submission.

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