Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

Award Information
Agency: Department of Defense
Branch: Army
Contract: DAAD19-02-C-0062
Agency Tracking Number: 44168-EL
Amount: $100,000.00
Phase: Phase I
Program: STTR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
1340 Eisenhower Place, Ann Arbor, MI, 48108
DUNS: 836493759
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Kazem Sabet
 (734) 973-6600
Business Contact
 Kazem Sabet
Title: President
Phone: (734) 973-6600
Email: ksabet@emagtechnologies.com
Research Institution
 University of Minnesota
 Sheryl N Goldberg
 University Gateway, Suite 450, 200 Oak Street SE
Minneapolis, MN, 55455
 (612) 626-2724
 Nonprofit college or university
"The objective of this Small Business Technology Transfer (STTR) project is to develop novel high performance three-dimensionally integrated package designs for optical modulator applications. There are many optoelectronic device designs that show greatpromise in the research lab, but have demonstrated degraded response once packaged. The proposed effort will develop advanced packaging methods that are complementary to chip-level electronic and photonic packaging. In the Phase I feasibility study, theconcept of the three-dimensionally integrated package will be explored through computer simulations. Since there is an ongoing effort on the experimental demonstration of the packaging concept for VCSEL arrays, in Phase I we will also investigate thelikely issues that may arise when extending the concept to optical modulators. Among these, we will place special emphasis on the optical fiber connection to the silicon optical microbench. The complete device and package designs will be carried out in thePhase II continuation of the project. The proposed STTR effort will introduce a new generation of high performance package designs for optoelectronic devices. The concepts and designs will be applicable to a wide range of components beyond opticalmodulators. The outcome of the project will have a major impact on high speed optical communication systems for both military and civilian communications."

* Information listed above is at the time of submission. *

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