Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$499,999.00
Award Year:
2003
Program:
STTR
Phase:
Phase II
Contract:
DAAD1903C0128
Award Id:
63196
Agency Tracking Number:
A2-0833
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1340 Eisenhower Place, Ann Arbor, MI, 48108
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
836493759
Principal Investigator:
Kazem Sabet
President
(734) 973-6600
ksabet@emagtechnologies.com
Business Contact:
Kazem Sabet
President
(734) 973-6600
ksabet@emagtechnologies.com
Research Institution:
UNIV. OF MINNESOTA
Sheryl N Goldberg
University Gateway, Suite 450, 200 Oak Street SE
Minneapolis, MN, 55455
(612) 626-2724
Nonprofit college or university
Abstract
The objective of this Small Business Technology Transfer (STTR) project is to develop three-dimensionally integrated packages for mixed DC/RF and optical inputs using micromachining techniques. There are many optoelectronic device designs that have showngreat promise in the research laboratory, but have demonstrated degraded response once packaged. The proposed effort will develop advanced packaging methods that are complementary to chip-level electronic and photonic packaging. The proposed genericpackage will demonstrate the feasibility of a three dimensional integrated package capable of driving high speed electronics and optics. The test package will be fabricated and evaluated with a passive test chip housing RF and photonic waveguidestructures. Computer simulation will be utilized to gain a thorough understanding of the package performance, and a comprehensive set of design rules will be developed to aid future designs. The proposed STTR effort will introduce a new generation of highperformance package designs for optoelectronic devices. The concepts and designs will be applicable to a wide range of components including optical modulators. The outcome of the project will have a major impact on high speed optical communication systemsfor both military and civilian communications.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government