Tunable, Low Mass, Low Loss, Millimeter Wave, MEMS RF Filters

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8718-05-C-0066
Agency Tracking Number: F051-230-3013
Amount: $99,935.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2005
Solicitation Topic Code: AF05-230
Solicitation Number: 2005.1
Small Business Information
1340 Eisenhower Place, Ann Arbor, MI, 48108
DUNS: 836493759
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Alex Margomenos
 Senior Research Engineer
 (734) 973-6600
Business Contact
 Kazem Sabet
Title: President
Phone: (734) 973-6600
Email: ksabet@emagtech.com
Research Institution
Emerging military, space and commercial communications systems, are placing a high premium on low-cost, small, light-weight RF electronic components, while at the same time increasing demands for higher functionality. Multiple communications and Radar systems are operating or being designed for the Ka-band (25-40 GHz) and above. This trend necessitates the utilization of high performance RF filters that operate well at that frequency band. In response to the above need, EMAG Technologies in collaboration with Purdue University propose to develop a novel, MEMS tunable high-Q filter. The proposed filter will be comprised of a series of evanescent mode cavities, which will be tuned with the use of a piezoelectric actuator. The proposed architecture requires a number of novel technologies that permit excellent RF performance, limited power consumption, low size and cost, high reliability and space qualification. In addition to that, on-wafer packaging and three-dimensional integration will be utilized for the hermetic sealing of the filters and MEMS varactors. This packaging scheme will be based on EMAG's already developed low-loss, hermetic package for single RF MEMS switches. The completed filter will be fabricated on a silicon wafer, thus allowing its integration with other planar active or passive components.

* Information listed above is at the time of submission. *

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