Reduced Size Weight and Power Consumption for SATCOM Antennas

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$729,785.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
W15P7T-06-C-P645
Award Id:
73974
Agency Tracking Number:
A052-107-3899
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
775 Technology Drive, Ann Arbor, MI, 48108
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
836493759
Principal Investigator:
Alex Margomenos
Senior Research Engineer
(734) 996-3624
amargo@emagtech.com
Business Contact:
Kazem Sabet
President
(734) 996-3624
ksabet@emagtech.com
Research Institute:
n/a
Abstract
Emerging military, space and commercial communications systems, are placing a high premium on low-cost, small size, weight and power consumption (SwaP) RF components, while at the same time increasing demands for higher functionality. This trend necessitates the utilization of low SWaP phased array antennas that operate well at that frequency band. The future-generation of wafer-scale antenna arrays will require 3D multi-layer modules for improved performance, reduced cost and minimized packaging complexity through 3D interconnects. This arrangement, however, will reduce the space for the active and passive components of the array including the power amplifiers, low noise amplifiers, matching networks, and interconnects. As a result, the heat flux per unit area (W/cm2) will be increased and conventional air cooling may be insufficient to effectively cool the antenna array since major heat generators (e.g. PAs) may be enclosed by wafers and will not have access to cold air from the outside environment. In order to address these issues, EMAG Technologies proposes to develop a 30 GHz wafer-scale array with an integrated microscale cooling system. Moreover, since it is very important that the micro-cooling system does not interact with the RF fields of the antenna array, electrothermal co-design of the system will be attempted.

* information listed above is at the time of submission.

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