Reduced Size Weight and Power Consumption for SATCOM Antennas

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$69,652.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
W15P7T-06-C-E001
Award Id:
73974
Agency Tracking Number:
A052-107-3899
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1340 Eisenhower Place, Ann Arbor, MI, 48108
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
836493759
Principal Investigator:
Alex Margomenos
Senior Research Engineer
(734) 973-6600
amargo@emagtech.com
Business Contact:
Kazem Sabet
President
(734) 973-6600
ksabet@emagtech.com
Research Institution:
n/a
Abstract
Emerging military and commercial communications systems are placing a high premium on low-cost, small, light-weight RF components, while at the same time increasing demands for higher functionality. To maximize data transfer, reduce size and minimize operation cost, communications front ends are forced to move to higher frequencies. This trend necessitates the utilization of high performance, low cost phased array antennas with reduced size, weight and power consumption (SWaP). In response to the above need, EMAG Technologies Inc., in collaboration with Purdue University, proposes to develop a Ka band wafer-scale phased array based on revolutionary concepts in packaging and three-dimensional integration. The amplifiers and wireless MEMS phase shifters will be fabricated on a single Si wafer along with the distribution network of the array. A separate wafer will carry the patch antennas, which will be backed by air-cavities for higher efficiency and gain. A third wafer will be used for packaging the MEMS phase shifters, mounting all the necessary digital circuitry for control, and providing input and output ports to the array. During this effort EMAG Technologies and Purdue will focus their effort on a novel wafer-scale phased array, a wafer-scale cooling system, and MEMS varactor-based phased shifters for providing beam steering capabilities.

* information listed above is at the time of submission.

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