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Wafer level Integration on PolyStrata(R) Interposer (WIPI) Phase II (17028)

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC18C0101
Agency Tracking Number: 175279
Amount: $749,953.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: S1
Solicitation Number: SBIR_17_P2
Solicitation Year: 2017
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-05-31
Award End Date (Contract End Date): 2020-05-30
Small Business Information
7586 Old Peppers Ferry Loop
Radford, VA 24141-8846
United States
DUNS: 827121455
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jean-Marc Rollin
 Sr. RF Engineer/PI
 (800) 341-2333
Business Contact
 Scott Meller
Phone: (800) 341-2333
Research Institution

Over the course of this program, Nuvotronics will develop of a robust wafer-level chip integration technology using our proprietary PolyStrata® process to enable sub-millimeter monolithic integrated chip (IC). This new process offers a disruptive wafer level packaging, capable of monolithically integrating dis-similar semiconductor substrates such as silicon, SiGe, GaAs, GaN and InP while reducing the interconnects losses and removing the need wirebonds. Using the 8” PolyStrata process on wafer, different chips (Low Noise Amplifiers, PAs, Mixers, switches) can be monolithically integrated and interconnected using copper microfabrication process to create a IC module. To demonstrate the performance of the new wafer level packaging approach, during the Phase II, Nuvotronics will leverage the new process to fabricate a complete W-band monolithic radiometer IC. The PolyStrata IC will be surface mountable using industry standard reflow process and will not require wirebonding, high accuracy placements or expensive RF circuit board. Nuvotronics aimed in this program a revolutionizing the way mm-wave circuit are fabricated by improving the interconnection performance up to 220 GHz and significantly reducing the packaging cost.

* Information listed above is at the time of submission. *

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