Low-Profile Tamper Detection Sensors

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-06-M-8070
Agency Tracking Number: F061-214-2220
Amount: $99,998.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2006
Solicitation Topic Code: AF06-214
Solicitation Number: 2006.1
Small Business Information
1965 Lycoming Creek Road, Suite 205, Williamsport, PA, 17701
DUNS: 028856420
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Gareth Knowles
 Principal Investigator
 (570) 322-2700
 gknowles@qortek.com
Business Contact
 Cathy Brooke
Title: Chief Financial Officer
Phone: (570) 322-2700
Email: cbrooke@qortek.com
Research Institution
N/A
Abstract
What is proposed is an inexpensive nearly undetectable method for detection of any effort to tamper with security sensitive electronics. This new approach would defeat the entire gamut of intrusion events from board probing through to device-level intrusive dissection making it extraordinarily difficult to reverse engineer the electronics. The use of a new class of semiconductor materials can be applied at individual IC level through to an entire circuit board assembly as to be extremely intrusion sensitive. External device integration can extend from very low profile integration to thick layer heat sink augmentation or replacement. Internal device integration options include Small Outline (SO), Ball Grid Array (BGA), and Land Grid Array (LGA). Integration of this new class of semiconductor materials also enables a completely new approach to autonomous electronics autodestruct in response to any unauthorized access attempt.

* Information listed above is at the time of submission. *

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