Non-Energetics-Based Self-Destruct Mechanisms

Award Information
Agency:
Department of Defense
Branch
Office of the Secretary of Defense
Amount:
$750,000.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-08-C-0275
Award Id:
78754
Agency Tracking Number:
O053-A12-2155
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1965 Lycoming Creek Road, Suite 205, Williamsport, PA, 17701
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
028856420
Principal Investigator:
GarethKnowles
Principal Investigator
(570) 322-2700
gknowles@qortek.com
Business Contact:
CathyBrooke
Chief Financial Officer
(570) 322-2700
cbrooke@qortek.com
Research Institute:
n/a
Abstract
The Phase II program continues a highly successful Phase I, where a silent, unobservable, non-energetic means directly incorporated within electronics completely obliterate IC die within microseconds. The destruct is so extensive as to deny, even with the most sophisticated reverse engineer techniques, ability to derive any information about the chip or its functions. Phase II effort focus is on developing optimized device integration of the demonstrated techniques with die of interest and many common package types. It will be shown that the technique can be covertly integrated into die packaging as to be inaccessible by an adversary. It will be shown that it enables a low cost solution to destroying all the security sensitive electronics components at the push of a button. The effort will include (i) ensuring self-destruct capability operates in a fail-safe mode, denying ability to bypass the protection by interrupting power, (ii) ensuring that any tamper event involving one component can trigger self-destruct of selectable set of security sensitive components. Phase II will also demonstrate various levels of autodestruct including autonomous, semi-autonomous, and distributed (where the destruct command is executed by on-board [boundary scan] monitoring and/or higher level system decision tree).

* information listed above is at the time of submission.

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