Production Enhancements for Integrated Anti-Tamper Technologies

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,967.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
W9113M-08-C-0045
Agency Tracking Number:
B073-028-0359
Solicitation Year:
2007
Solicitation Topic Code:
MDA07-028
Solicitation Number:
2007.3
Small Business Information
QORTEK, INC.
1965 Lycoming Creek Road, Suite 205, Williamsport, PA, 17701
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
028856420
Principal Investigator:
Gareth Knowles
Principal Investigator
(570) 322-2700
gknowles@qortek.com
Business Contact:
Cathy Brooke
Chief Financial Officer
(570) 322-2700
cbrooke@qortek.com
Research Institution:
n/a
Abstract
The primary objective of this Phase I program will be to demonstrate a greatly improved manufacturing and production techniques for die packaging of anti-tamper capabilities. We aim to show through manufacture engineering research, software development and hardware prototypes, a new low-cost technique for multi-threat capable Anti-Tamper (AT) device manufacture and AT software-based multi-threat Die production packaging that will reduce the present risks associated with direct hardware AT integration with a range of security critical devices (such as FPGA, ASIC, memory and RF die wafers). Being guided by an MDA prime contractor/end-use integrator of the technology will substantially focus the efforts and improve chances for successful integration of protective techniques/technologies into several key MDA missions that are ongoing. The results will be largely applicable to many forms and types of hardware AT device packaging.

* information listed above is at the time of submission.

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