Dynamically softening implantable microelectrode arrays

Project summary
We propose to demonstrate the feasibility of softening multi shank microelectrode arrays which are stiff during
insertion and soft during chronic useTo dateno one has demonstrated aD softening electrode arrayCurrent technologiesmade from silicon can be miniaturehigh densitybatch fabricated and capable of
supporting active on board electronicsSiliconhoweveris a brittle materialand while its stiffness allows for
easy implant into soft neural tissueit presents a serious mechanical mismatch between the implanted device
and the soft neural tissue after implantOther current penetrating flexible electronics technologies have been
limited toD structuresIn this Phase I SBIR proposalQualia Incwill explore the feasibility of adapting its planar processing thin film
photolithography technologies into a third dimensionPrevious SBIR funding from DARPA helped establish our
shape memory polymerSMPsubstrates as candidates for chronically viable neural implantsHoweverour
past studies have been limited toD devicesIn this proposalwhich is focused on innovative packaging
technologieswe aim to createD architectures which fill a critical void in the neuroscience research
community Project Narrative
A central goal of contemporary neuroscience is to understand the relationships between the functional
connectivity map of neuronal circuits and their physiological or pathological functionsCurrent multi shank
microelectrode arraysthe tools used to assess these phenomenaare not chronically stable limiting their
clinical efficacyQualia Incproposes a softeningD multi shank electrode technology that could extend the
lifetime and increase the performance of implantable bioelectronics