Wafer-Level Electronic-Photonic Co-Packaging

In phase II work, we will collaborate with Prof. Stefan Preble in RIT and continue to develop large scale hybrid integration and packaging techniques for key active photonic components such as lithium niobate on insulator (LNOI) modulators and modified uni-traveling (MUTC) photodiodes. We will demonstrate a low V, broadband, small footprint LNOI modulator with hybrid Si/LN or SiN/LN waveguide using the proposed integration process. We will study different coupling schematics for characterization and further system integration of the hybrid LNOI modulator. We will develop and refine the critical wafer bonding and thin-film transferring processes using our new wafer bonding tool to improve fabrication reliability and uniformity. We will develop die-bonding based packaging approach for MUTC PD and PD array using high power SiN waveguides for light routing and pick-and-placed micro-prisms for vertical light coupling. PSI will also start working on a PIC solution for our phased array Tx system. We will condense many of the current functionalities into a single PIC chip design using available building elements as well as new devices modified based on the AIM photonics PDK tool box. We are planning to run two tape-outs to test the developed devices, subsystems and a full Tx processor chip.