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Additive Manufacturing for Microwave Vacuum Electron Device Cost Reduction

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-18-C-0103
Agency Tracking Number: N16A-010-0166
Amount: $999,951.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: N16A-T010
Solicitation Number: 16.A
Timeline
Solicitation Year: 2016
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-02-07
Award End Date (Contract End Date): 2020-02-14
Small Business Information
1717 Stewart Street
Santa Monica, CA 90404
United States
DUNS: 140789137
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Pedro Frigola
 Sr. Researcher
 (310) 822-5845
 frigola@radiabeam.com
Business Contact
 Alex Murokh
Phone: (310) 822-5845
Email: murokh@radiabeam.com
Research Institution
 SLAC National Accelerator Laboratory
 Mike Gonzalez Mike Gonzalez
 
2575 Sand Hill Rd.
Menlo Park, CA 94025
United States

 (650) 926-4261
 Federally funded R&D center (FFRDC)
Abstract

The Department of the Navy has a need for the development of an additive manufacturing (AM) process for key vacuum electronic device components to meet on-demand, flexible, and affordable manufacturing requirements. The goal of this Phase II effort is to develop and validate Electron Beam Melting (EBM) additive manufacturing (AM) technology for the production of vacuum electronic devices meeting the specific systems needs (including cost reduction) of the DON. In particular this project aims to deliver an AM process for direct production of VEDs with a 70% cost reduction. In the Phase II effort, a full coupled cavity travelling wave tube (TWT) structure attached to two ceramic isolators on both ends will be built and demonstrated for RF performance (cold test), high voltage isolation, and ultra-high vacuum holding capability. This approach will also demonstrate the capability of single-step production of complex systems confirming clean and full density material conditions, mechanical tolerance, and surface roughness requirements. In addition, this development will also open opportunities for improved thermal management designs for RF circuit cavities as well as for more advanced RF circuit cavity designs.

* Information listed above is at the time of submission. *

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