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A Modular Cluster Tool for Semiconductor Failure Analysis

Award Information
Agency: Department of Defense
Branch: Defense Microelectronics Activity
Contract: HQ072718P0019
Agency Tracking Number: 18-8B0
Amount: $149,578.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: DMEA172-001
Solicitation Number: 2017.2
Solicitation Year: 2017
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-08-16
Award End Date (Contract End Date): 2019-02-15
Small Business Information
P.O Box 10520
Jackson, WY 83002
United States
DUNS: 128363145
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert Viola
 (307) 734-0211
Business Contact
 Robert Viola
Phone: (307) 734-0211
Research Institution

Advanced semiconductor devices are the beating heart of 21st Century technology.The mission critical role that these devices play demands exceptional levels of reliability.When a semiconductor device does fails, it is essential that the cause of the failure is identified as quickly as possible.Because a devices chip is encapsulated in a thermoplastic package, a significant amount of intricate material removal must be performed before a chips failure location can be observed directly.However, this material removal is generally performed manually and critical forensic evidence is often destroyed during sample preparation.To address the limitations of current sample preparation techniques, a Modular Cluster Tool (MCT) is proposed.This system mates high precision chip manipulation and advanced non-contact metrology with existing material removal tools.The MCTs modular design allows it to perform a wide range of material removal tasks on a variety of different semiconductor devices.A high level of operational autonomy minimizes human involvement in the sample preparation process.

* Information listed above is at the time of submission. *

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