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Soft Bio-Interfaces for Physiological Sensing and Modulation

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: 140D6318C0097
Agency Tracking Number: D2-2006
Amount: $1,478,544.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: SB153-001
Solicitation Number: 15.3
Solicitation Year: 2015
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-08-22
Award End Date (Contract End Date): 2021-09-21
Small Business Information
17217 Waterview Pkwy Suite 1.202
Dallas, TX 75252
United States
DUNS: 080158943
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Romil Modi
 Senior Research Engineer
 (972) 861-2420
Business Contact
 Walter Voit
Phone: (972) 861-2420
Research Institution

The main objective of this Phase II.2 DARPA SBIR proposal is to develop a robust and reliable electrical connection strategy for softening implantable electrode arrays and industry standard connectors for use in chronic animal models at research facilities throughout the world. The Phase II.2 base period consists of two tasks: 1) to connect softening neural interfaces to wire-based and flexible polymer cables using novel conductive adhesives, and 2) to use traditional microfabrication techniques with morphing polymers to create strain-tolerant cabling structures. In both tasks, we will test the robustness of these electrical connections in response to mechanical cycling under physiologic conditions as well as under accelerated aging and prepare the resulting devices for sale to the research neuroscience community at large. This DARPA Phase II.2 project will enable interconnect and cabling strategies that will not only impact the success of softening bioelectronics devices, but also create a new cabling solution for a variety of device architectures supplied by other companies. Led by Qualia, this proposal leverages expertise in biomaterials and neural engineering from the University of Texas at Dallas.

* Information listed above is at the time of submission. *

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