Waste Minimization in Circuit Board Manufacture by Powder Coating and Metallo-Organic Decomposition

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 26679
Amount: $749,979.00
Phase: Phase II
Program: SBIR
Awards Year: 1996
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Partnerships Limited, Inc.
P.o. Box 6042, Lawrenceville, NJ, 08648
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Paul Kydd
 (609) 896-2193
Business Contact
Phone: () -
Research Institution
N/A
Abstract
The objective of this program is to investigate the feasibility of a novel method of fabricating printed circuit boards based on Metallo-Organic Decomposition technology. This technology was first investigated for applying metallization to solar cells by ink jet printed, For circuit board applications heavier traces are required to obtain adequate conductivity, and the present program proposes to achieve this by enhancing the printed image by powder coating additional MOD compound. The program will investigate materials for powder coating, provision of a printed image which will adhere the power, powder de-composition and production of printed circuit samples. A successful Phase I and Phase II program will provide prototype processing equipment and materials which will permit direct printing and enhancement of circuit boards without photolithography, etching or plating. Circuit boards will be produced directly from CAD files without generation of wastes of any kind. Anticipated Benefits: The technology to be investigated will provide the capability to produce custom boards or short runs and minimize inventory costs for private sector producers. For defense systems it offers an approach to direct write conformal applications such as aircraft antennas.

* information listed above is at the time of submission.

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