Materials for Printing Electronic Components

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$98,998.00
Award Year:
1998
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
41312
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
PARTNERSHIPS LIMITED, INC.
P.O. Box 6042, Lawrenceville, NJ, 08648
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Paul Kydd
(609) 279-0072
Business Contact:
() -
Research Institution:
n/a
Abstract
The objective of this Phase I program is to demonstrate the technical feasibility of functional materials that can be applied by a simple print-and-heat process at temperatures below 400 C to create electronic components on a variety of substrates. The technology to be demonstrated is an extension of the existing PARMOD process from metallic conductors to resistors, capacitors and inductors based on oxide phases. A successful result in Phase I will permit demonstration of producing complete electronic circuits by a maskless, computer-driven tool in Phase II. Both conductors and functional components will be applied in a multilayer structure to create a selected circuit of military interest on low-cost polymer-based substrates.

* information listed above is at the time of submission.

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