Materials for Printing Electronic Components
Department of Defense
Defense Advanced Research Projects Agency
Agency Tracking Number:
Solicitation Topic Code:
Small Business Information
PARTNERSHIPS LIMITED, INC.
P.O. Box 6042, Lawrenceville, NJ, 08648
Socially and Economically Disadvantaged:
AbstractThe objective of this Phase I program is to demonstrate the technical feasibility of functional materials that can be applied by a simple print-and-heat process at temperatures below 400 C to create electronic components on a variety of substrates. The technology to be demonstrated is an extension of the existing PARMOD process from metallic conductors to resistors, capacitors and inductors based on oxide phases. A successful result in Phase I will permit demonstration of producing complete electronic circuits by a maskless, computer-driven tool in Phase II. Both conductors and functional components will be applied in a multilayer structure to create a selected circuit of military interest on low-cost polymer-based substrates.
* information listed above is at the time of submission.