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Heterogeneous Porous Media for Thermal Transport Mitigation in Hypersonics

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-18-C-0003
Agency Tracking Number: F161-005-0267
Amount: $749,877.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: AF161-005
Solicitation Number: 2016.1
Solicitation Year: 2016
Award Year: 2018
Award Start Date (Proposal Award Date): 2017-12-02
Award End Date (Contract End Date): 2019-09-23
Small Business Information
216 West Cherry Ave., Bldg. 2
Flagstaff, AZ 86001
United States
DUNS: 932699192
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Stephen D.Miller
 (928) 779-5000
Business Contact
 Stephen Miller
Phone: (928) 779-5000
Research Institution

S. D. Miller and Associates (SDMA) developed Opacified Fibrous Insulation (OFI) to replace MultiLayer Insulation (MLI) on the Falcon hypersonic vehicles.In 2015, OFI demonstrated improved efficiency in Hypersonic Inflatable Aerodynamic Decelerator (HIAD) TPS, and became part of the preferred HIAD TPS.In Phase I, SDMA demonstrated OFI production in continuous rolls in a 12-in. width using pilot production facilities.The OFI was consistent thermally and mechanically, and 47% more thermally efficient on a thickness basis than OFI samples made previously by other methods.Transmittance measurements were also used to test our understanding of radiative heat transfer in OFI, and it was determined that further work is needed on a model that accurately predicts heat transfer from first principles.In Phase II, a model will be developed to predict heat transfer through OFI, and this model will be tested against experimental data.A trades study will be completed using input from the model and experimental measurements to optimize a few OFI variants for different applications.Pilot productions facilities will be used to make OFI in continuous, 4-foot wide rolls.Data from thermal and mechanical tests, and simulated flight experiments will be used in a Technical Data Package for Technology Integrators.

* Information listed above is at the time of submission. *

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