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Digital Pixel Sensor with Efficient On-Chip Data Compression

Award Information
Agency: Department of Defense
Branch: Army
Contract: W909MY-18-C-0005
Agency Tracking Number: A2-6935
Amount: $999,995.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A16-040
Solicitation Number: 16.1
Solicitation Year: 2016
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-07-17
Award End Date (Contract End Date): 2020-07-16
Small Business Information
5383 Hollister Ave. Ste. 230
Santa Barbara, CA 93111
United States
DUNS: 831934414
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Kenton Veeder
 (805) 617-0337
Business Contact
 Lilia Barbosa
Phone: (805) 617-0337
Research Institution

This proposal outlines a very high dynamic range large-format small-pitch low-power digital pixel readout integrated circuit (DPROIC) for infrared focal plane arrays and will be designed to support an entire family of formats. This DPROIC will have on-chip compression for efficient transmission of data on large format, fast data rate sensors. This digital pixel readout will be a complete camera-on-chip architecture when combined with an SLS detectors in a hybrid fashion. It will also operate over a wide range from cryogenic to room temperature to support a broad range of detector architectures. The proposed DPROIC will be implemented in a mature CMOS process with much more reasonable mask costs as compared to that of state-of-the-art line width processes, saving the government money and broadening the possible supplier base. The final product will be flexible enough to be used as a generic readout integrated circuit for a broad range of Army and US Government applications.

* Information listed above is at the time of submission. *

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