3D Memristor Architectures for Software Defined Radio

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,108.00
Award Year:
2010
Program:
SBIR
Phase:
Phase I
Contract:
N00039-10-C-0056
Award Id:
98285
Agency Tracking Number:
N093-222-0984
Solicitation Year:
n/a
Solicitation Topic Code:
NAVY 09-222
Solicitation Number:
n/a
Small Business Information
1250 Capital of Texas Highway South, Building 3, Suite 400, Austin, TX, 78746
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
788622012
Principal Investigator:
Burt Fowler
Principal Investigator
(512) 431-8460
burt@privatran.com
Business Contact:
Glenn Mortland
President
(512) 633-3476
gmortland@austin.rr.com
Research Institute:
n/a
Abstract
PrivaTran proposes the use of newly-developed manufacturing methods that convert materials commonly found in conventional integrated circuit (IC) manufacturing into memristor devices with increased packing density and an advanced, three-dimensional (3D) architecture. The memristor devices can be formed in the interconnect layers of a conventional IC so that the area available for underlying transistors is not affected. This approach results in a 3D architecture achieved using a single substrate without the need for bonding multiple die together with flip-chip or through-silicon-via technologies. Furthermore, the memristor devices are much smaller than single transistors for any given technology node, and will scale to smaller dimensions as IC technology continues to progress towards smaller and smaller transistor sizes. The two-terminal memristor devices have numerous advantages including on/off conductance ratios greater than 104, reversible and fast switching, long retention times and immunity to current-induced degradation. In addition, their inherent simplicity makes them highly compatible with Si-based microelectronics technology, leading to a 3D architecture that can be readily transferred into semiconductor products at the most basic, integrated circuit level.

* information listed above is at the time of submission.

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