Automated Wafer Polishing for Epi-ready Antimony-based Substrate Materials

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: FA8650-04-M-5427
Agency Tracking Number: B041-083-1003
Amount: $99,737.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: MDA04-083
Solicitation Number: 2004.1
Small Business Information
590 Territorial Drive, Suite B, Bolingbrook, IL, 60440
DUNS: 068568588
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Rasdip Singh
 (630) 771-0203
Business Contact
 Sivalingam Sivananthan
Title: President
Phone: (630) 771-0201
Research Institution
EPIR Technologies has experience in polishing II-VI semiconductor substrates for MBE applications. We propose to transfer this experience to the polishing of Sb-based substrates. The quality of a surface is determined by the degree of surface flatness (or curvature), smoothness, stoichiometry, and the magnitude of surface/sub-surface damage. All these parameters are addressed in this proposal. We propose to achieve an atomically smooth substrate surface by using an abrasive-free chemical polishing procedure. In order to reduce polishing damage, new sample holders with the capability of varying the load or pressure on the sample will be made since there are no commercially available jigs. We propose innovative ideas for controlling and monitoring the chemistry of the chemical polishing solutions. The ability to correctly compare the effects of different chemical solutions requires that the viscosities of the chemical solutions remain unchanged. EPIR will expand on its proprietary procedure for measuring and matching the viscosities of different polishing solutions, which will be a key issue in polishing Sb-based substrates. EPIR will carryout a full pressure-dependent/non-contact polishing study with an emphasis on comparing and optimizing chemical polishing solutions.

* Information listed above is at the time of submission. *

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