Development of Low Stress Ohmic Contacts to HgCdTe

Award Information
Agency:
Department of Defense
Amount:
$69,967.00
Program:
SBIR
Contract:
W15P7T-06-C-T003
Solitcitation Year:
2005
Solicitation Number:
2005.2
Branch:
Army
Award Year:
2005
Phase:
Phase I
Agency Tracking Number:
A052-099-1062
Solicitation Topic Code:
A05-099
Small Business Information
EPIR TECHNOLOGIES, INC.
590 Territorial Drive, Suite B, Bolingbrook, IL, 60440
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
068568588
Principal Investigator
 Paul Boieriu
 Senior Engineer
 (630) 771-0203
 pboieriu@epir.com
Business Contact
 Sivalingam Sivananthan
Title: President
Phone: (630) 771-0201
Email: siva@epir.com
Research Institution
N/A
Abstract
The problem to be solved in the proposed work is that the deposition of the usual In and Au metal contacts on HgCdTe-based IR detectors creates additional stress in the HgCdTe immediately below the contacts, This stress has been observed to getter threading dislocations, which, in turn, creates misfit dislocation segments just below the detector surface and parallel to the surface, in the active area under and close to the contacts. The dangling bonds across these dislocations enhance random generation-recombination processes, thereby reducing quantum efficiencies and detectivities. Because of their location, these misfit dislocations act as especially efficient trapping and recombination centers and strongly degrade detector performance, especially in the long wavelength and very long wavelength ranges. They degrade the zero-bias impedance (R0A) and increase the dark current. The dangling bonds across these dislocations enhance random generation-recombination processes, thereby reducing quantum efficiencies and detectivities. We propose to eliminate or greatly reduce this gettering of threading dislocations and the resultant formation of misfit dislocations by contact deposition on HgCdTe long wavelength infrared (LWIR) detectors.

* information listed above is at the time of submission.

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