High Speed Room Temperature Infrared Imaging

Award Information
Agency:
Department of Defense
Branch:
Defense Advanced Research Projects Agency
Amount:
$98,914.00
Award Year:
2005
Program:
STTR
Phase:
Phase I
Contract:
W31P4Q-05-C-0254
Agency Tracking Number:
05ST1-0058
Solicitation Year:
2005
Solicitation Topic Code:
ST051-005
Solicitation Number:
N/A
Small Business Information
EPIR TECHNOLOGIES, INC.
590 Territorial Drive, Suite B, Bolingbrook, IL, 60440
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
068568588
Principal Investigator
 Silviu Velicu
 Senior Engineer
 (630) 771-0206
 svelicu@epir.com
Business Contact
 Sivalingam Sivananthan
Title: President
Phone: (630) 771-0201
Email: siva@epir.com
Research Institution
 UNIV. OF MICHIGAN
 Jamie Phillips
 EECS Department, 2417D EECS Bldg 1301 Beal Av
Ann Arbor, MI, 48109
 (734) 764-4157
 Nonprofit college or university
Abstract
We propose the development of infrared detectors with high detectivities operating at high speeds and at room temperature in the 1-12 micron wavelength range using a combination of two techniques. First, non-equilibrium device operation concepts will be implemented to suppresses both radiative and Auger recombination. Second, the detector volume is incorporated into a resonant cavity, which gives rise to a substantial reduction of thermal generation currents by permitting a small active volume without degrading the quantum efficiency. It also permits the predetermination of the peak wavelength of the optical resonance, and high speed operation is obtained due to short carrier transit times. In Phase I, we will develop a 2D model simulating the performance of the detectors fabricated based on the above techniques. EPIR Technologies will model the electrical and optical characteristics of these detectors and establish the feasibility of growing them by molecular beam epitaxy. The University of Michigan will model their transient response using the carrier continuity equations based on drift, diffusion, and G-R processes in the semiconductor material. SPILAB, a subcontractor for this program, will study the detector-signal processor interface.

* information listed above is at the time of submission.

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