Three Dimensional Integration of Compound Semiconductor and SOI Integrated Circuits (BMDO02-214B)

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$68,946.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
DTRA01-02-P-0136
Award Id:
58991
Agency Tracking Number:
02-0772
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1450 South Rolling Road, Baltimore, MD, 21227
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
171899719
Principal Investigator:
AyubFathimulla
Vice President, R&D
(410) 455-5830
ayub@epiwafres.com
Business Contact:
OlaleyeAina
President
(410) 455-5594
aina@epiwafers.com
Research Institute:
n/a
Abstract
"Epitaxial Technologies proposes to develop an innovative three dimensional (3-D) monolithic integrated circuits technology that will combine the high-performance capabilities of III-V compounds with the low cost and very large scale integration capabilityof Si chip manufacturing. We will achieve this by investigating various material structure, wafer growth, wafer bonding and fabrication concepts and techniques to enable 3D integration without degrading device and circuit performance.In Phase I, we will investigate the growth, fabrication and testing of a variety of device structures such as HBTs, HEMTs and photodiodes on InP bonded to SOI. During Phase II, we will optimize the epitaxial materials and bonding technology and integratemillimeter wave ICs, photo receivers and sensors with CMOS circuits on bonded SOI substrates. This project will result in several types of products: highly integrated multifunction chips and components, and the wafers for fabricating them. The products will be applicable in most DoD and BMDO weapons systems including multi-domain sensors, mm-wavecameras for battlefield target tracking and identification and secure communications. Civilian applications include advanced synthesizers and integrated transceivers for broadband wireless and wireline telecommunications."

* information listed above is at the time of submission.

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