Three Dimensional Integration of Compound Semiconductor and SOI Integrated Circuits (BMDO02-214B)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DTRA01-02-P-0136
Agency Tracking Number: 02-0772
Amount: $68,946.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solitcitation Year: N/A
Solitcitation Topic Code: N/A
Solitcitation Number: N/A
Small Business Information
Epitaxial Technologies, Llc
1450 South Rolling Road, Baltimore, MD, 21227
Duns: 171899719
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ayub Fathimulla
 Vice President, R&D
 (410) 455-5830
 ayub@epiwafres.com
Business Contact
 Olaleye Aina
Title: President
Phone: (410) 455-5594
Email: aina@epiwafers.com
Research Institution
N/A
Abstract
"Epitaxial Technologies proposes to develop an innovative three dimensional (3-D) monolithic integrated circuits technology that will combine the high-performance capabilities of III-V compounds with the low cost and very large scale integration capabilityof Si chip manufacturing. We will achieve this by investigating various material structure, wafer growth, wafer bonding and fabrication concepts and techniques to enable 3D integration without degrading device and circuit performance.In Phase I, we will investigate the growth, fabrication and testing of a variety of device structures such as HBTs, HEMTs and photodiodes on InP bonded to SOI. During Phase II, we will optimize the epitaxial materials and bonding technology and integratemillimeter wave ICs, photo receivers and sensors with CMOS circuits on bonded SOI substrates. This project will result in several types of products: highly integrated multifunction chips and components, and the wafers for fabricating them. The products will be applicable in most DoD and BMDO weapons systems including multi-domain sensors, mm-wavecameras for battlefield target tracking and identification and secure communications. Civilian applications include advanced synthesizers and integrated transceivers for broadband wireless and wireline telecommunications."

* information listed above is at the time of submission.

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