Open Call for Innovative Defense-Related Dual-Purpose Technologies/Solutions

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA3002-18-P-0044
Agency Tracking Number: F182-005-1652
Amount: $49,990.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF182-005
Solicitation Number: 2018.2
Timeline
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2018-08-03
Award End Date (Contract End Date): 2018-11-02
Small Business Information
2900 South Main Street, Salt Lake City, UT, 84115
DUNS: 013017947
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Jennifer Hwu
 (801) 975-7399
 hwu@innosystech.com
Business Contact
 Larry Sadwick
Phone: (801) 975-7399
Email: sadwick@innosystech.com
Research Institution
N/A
Abstract
Vacuum electronic devices (VEDs) have demonstrated their ruggedness and insensitivity to harsh environments, making them the top choice for mitigating high Electromagnetic Pulse (EMP) in military operations and missions.However, manual and cumbersome fabrication does not permit VEDs to circuit integration including integrated circuit (IC) formats to ensure best reliability and performance. InnoSys has successfully demonstrated its Solid State Vacuum DeviceTM (SSVDTM) concept of employing advanced microfabrication and IC fabrication into VED design to dramatically improve performance, reliability and manufacturing.We shall make basic building blocks for EMP insensitive digital and analog ICs with inherent operate-through capability requiring minimal shielding and/or C&R.The components and circuits to be developed for this SBIR will be suitable for volume production enhancing availability, affordability and market applications.These devices will include power electronics, Stay Alive, RF transmitters, and harsh environment, analog and digital, uncooled electronics including detection, control and protection circuits. This proposed SBIR will introduce and advance a new era in vacuum electronic devices: one in which automated lithographic fabrication and assembly techniques developed for solid state devices are employed to build devices and circuits capable of meeting military and commercial needs including EMP insensitive, radiation insensitive, uncooled, and extreme environment electronics.

* Information listed above is at the time of submission. *

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