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Low Cost High Performance Solar Arrays for SmallSats and CubeSats

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-19-P-0523
Agency Tracking Number: F182-066-0881
Amount: $149,999.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF182-066
Solicitation Number: 2018.2
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2018-11-19
Award End Date (Contract End Date): 2019-11-19
Small Business Information
6457 Howard Street, Niles, IL, 60714
DUNS: 135553472
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Glen Hillier
 (847) 588-3001
Business Contact
 Noren Pan
Phone: (847) 588-3001
Research Institution
MicroLink Devices proposes to integrate its high-efficiency, lightweight, and flexible solar sheet technology onto cube and small satellites at greatly reduced costs over conventional CIC technology.MicroLinks epitaxial lift-off (ELO) based solar cells have efficiencies of 30% at 1-sun AM0 with specific powers more than 2000 W/kg.This is a breakthrough technology that can answer the needs of the Air Force in identifying a low cost, radiation tolerant, and reliable space solar cell.In this Phase I effort, MicroLink will develop a lower cost solar array compatible and scalable to cubesats and small satellites.Using the ELO approach, a flexible coverglass technology known as pseudomorphic glass (PMG) was previously demonstrated.It demonstrated a pathway to significantly reduced manufacturing costs of photovoltaic arrays from the current cost of $1000/W down to approximately $250/W.This technology is an ideal solution for maximum power generation in a limited area, volume, and weight such as cube and small satellites.It will enhance performance through ease of deployment, reduced weight, and stowage volume as compared to CIC technology.MicroLink anticipates a 100% improvement in specific power, and a 50% reduction in stowable volume without sacrificing radiation tolerance or array performance.

* Information listed above is at the time of submission. *

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