Compound semiconductor bypass and blocking diodes with improved temperature and radiation performance

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-19-P-0532
Agency Tracking Number: F182-069-0896
Amount: $150,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF182-069
Solicitation Number: 2018.2
Timeline
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2018-12-20
Award End Date (Contract End Date): 2019-12-20
Small Business Information
6457 Howard Street, Niles, IL, 60714
DUNS: 135553472
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Chris Youtsey
 (847) 588-3001
 cyoutsey@mldevices.com
Business Contact
 Noren Pan
Phone: (847) 588-3001
Email: npan@mldevices.com
Research Institution
N/A
Abstract
In this Phase I program we will demonstrate the feasibility of building high-performance diodes for space arrays using compound semiconductors. Wider bandgap materials offer not only higher breakdown voltages using thinner device structures, they also enable substantially improved high-temperature performance and enhanced radiation resistance. We will first carry out a trade study using advanced device simulation software in collaboration with Prof. Patrick Fays research group at the University of Notre Dame to explore the potential of using GaAs, InGaP, InP and GaN materials. Each of these provides unique trade-offs with respect to critical electrical field, radiation tolerance, cost and manufacturability. We will down select to a material system with the greatest potential for commercialization and fabricate test devices to demonstrate electrical performance and stability under a wide range of operating temperature. Our objective is to manufacture diodes that with long-term stability and low reverse leakage current at 250 C and a 3x improvement in radiation hardness relative to comparable Si devices. The diodes will also leverage MicroLink Devices proprietary epitaxial lift-off (ELO) technology to realize an exceptionally thin form factor that will enable new packaging and solar array integration options.

* Information listed above is at the time of submission. *

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