Resistive Material Measurement Probe to Measure the Health of Embedded Rcards

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-19-P-5060
Agency Tracking Number: F182-096-0744
Amount: $149,854.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF182-096
Solicitation Number: 2018.2
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2018-12-17
Award End Date (Contract End Date): 2019-12-17
Small Business Information
1005 Alderman Dr, Ste 203, Alpharetta, GA, 30005
DUNS: 968612858
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. John Schultz
 (678) 279-5825
Business Contact
 Rebecca Schultz
Phone: (678) 279-5825
Research Institution
Degradation of specialty materials and structures due to damage or normal wear needs early detection to ensure an aircraft is fully mission-ready. The resistive layer or R-card, which is of interest in this topic, is subject to degradation over time through oxidation/aging, fuels or oils exposure, temperature cycling, and even physical damage such as bird-strike. This proposal addresses the need for an inspection sensor and methodology to detect degradation or damage to R-cards while they are embedded within a structure. Because the R-card is under a top-coat material, it cannot be directly electrically connected to a sensor such as an ohm-meter. Instead, an impedance meter must use capacitive coupling to excite currents and then sense the excited current. Moreover, the sensor must be small and lightweight so that it can be easily used on a vehicle in a depot or hangar environment. Ideally the sensor should be handheld and include a built-in radio frequency (RF) transmitter/receiver. In order for a new method to be adopted by maintainers, it must be easy and convenient to use. Therefore, CTG proposes a field deployable and compact diagnostic measurement system that meets the need for assessing operational readiness, while also being affordable.

* Information listed above is at the time of submission. *

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