3D Printed Component Packages for Semiconductor Die

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-19-C-7138
Agency Tracking Number: B2-2692
Amount: $985,692.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA17-011
Solicitation Number: 2017.2
Timeline
Solicitation Year: 2017
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-03-14
Award End Date (Contract End Date): 2021-03-13
Small Business Information
1300 Meridian Street, Huntsville, AL, 35801
DUNS: 796514763
HUBZone Owned: Y
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Michael Whitley
 (256) 261-1260
 michael.whitley@engeniusmicro.com
Business Contact
 Chris Heaton
Phone: (256) 261-1260
Email: chris.heaton@engeniusmicro.com
Research Institution
N/A
Abstract
This proposal has potential commercial benefits of providing packaging for obsolete semiconductor die or small runs of semiconductor die. Additional commercial benefits include providing more versatile packaging options than currently exist.Approved for Public Release | 19-MDA-9932 (21 Feb 19)

* Information listed above is at the time of submission. *

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