Low-SWaP-C, 3D Printed Radiation Shielding For Microelectronics (1000-477)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-19-C-7140
Agency Tracking Number: B2-2729
Amount: $996,176.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA17-012
Solicitation Number: 2017.2
Timeline
Solicitation Year: 2017
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-03-15
Award End Date (Contract End Date): 2021-03-14
Small Business Information
267 Boston Road, North Billerica, MA, 01862
DUNS: 131640919
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. Erik Handy
 (978) 495-5326
 pi@si2technologies.com
Business Contact
 Noel Marie Burgoa
Phone: (978) 495-5302
Email: nburgoa@si2technologies.com
Research Institution
N/A
Abstract
The proposed printed radiation shielding technology will afford robust microelectronics protection without the size, weight, power, cost, and schedule burden of conventional shield approaches.SI2s shielding solution also has application to electronics used in satellites, nuclear facilities, and medical facilities.Approved for Public Release | 19-MDA-9932 (21 Feb 19)

* Information listed above is at the time of submission. *

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