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Integration of Onboard Distributed Flow Sensing Using AF Intellectual Property US9658087B1

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-19-P-2701
Agency Tracking Number: F183-008-0122
Amount: $74,977.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF183-008
Solicitation Number: 2018.3
Timeline
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-05-08
Award End Date (Contract End Date): 2021-05-08
Small Business Information
4030 Spencer St, Suite 108
Torrance, CA 90503
United States
DUNS: 106823607
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 JAY KUDVA
 (310) 891-2814
 jkudva@nextgenaero.com
Business Contact
 Zoltan Feher
Phone: (310) 626-8384
Email: zfeher@nextgenaero.com
Research Institution
N/A
Abstract

Advances over the last decade in sensors, miniature and flexible electronics, wireless protocols, and related technologies now make it feasible to sensecontinuously and accurately - environmental and operational parameters over the entire surface of an aircraft using a wide network of sensors. A specific example, and the subject of this proposal, is the AFRL-developed Artificial Hair Sensors (AHS) for flow velocity measurement. The overall goal of this SBIR is to mature the prototype AHS and associated technologies incubated at AFRL to develop reliable, easy-to-use, easy-to-install, low-cost flow sensors for air vehicles.To transition AHS from the lab to a viable, commercial product (or a family of application specific products) we will need to address cost, volume fabrication, handling, calibration, ease-of-installation and other manufacturing, operational and business issues. To this end, and consistent with the solicitation, NextGen proposes to establish the business case and define needed product and process improvements in Phase I. The study will include inputs from potential users, customers and other stakeholders; improvements will focus on fabrication processes, associated electronics, and ease-of-use for a set of targeted applications. We will segue to implementing both in a potential Phase II program.

* Information listed above is at the time of submission. *

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