Drilling 170 Micron Diameter Holes

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F29601-02-C-0117
Agency Tracking Number: 021NM-1930
Amount: $99,976.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Extrude Hone Corp.
1 Industry Blvd, P.O. Box 1000, Irwin, PA, 15642
DUNS: 002943975
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ralph Resnick
 Chief Technology Officer
 (724) 863-5900
 ralphr@extrudehone.com
Business Contact
 Hilary Gilmore
Title: Research Administrator
Phone: (724) 863-5900
Email: hilaryg@extrudehone.com
Research Institution
N/A
Abstract
"This project proposes to develop and quantify the performance characteristics for processing the holes in the injector heads of the ABL weapon system. The objective is to provide the Air Force and supporting contractors with the technology and equipment tomanufacture holes of virtually arbitrary size, contour and accuracy. Techniques and concepts that will form the basis of machining holes with a new short-pulse laser system will be investigated. Specifically, it will be determined if it is feasible toproduce holes of sufficient quality and at production rates capable of meeting specifications for the injector heads of the laser modules for the Air Force ABL weapon system. Development of short-pulse laser machining technology and processing parameterswill lead to the design, manufacture and demonstration of a prototype Short-Pulse Laser Machining system capable of meeting the objectives of the injector heads for the laser modules on the Air Force ABL in Phase II. The new short-pulse laser technologyproposed represents a significant advance in precision manufacturing and its potential is of the same order as other revolutionary new machining technologies of the past few decades. Short-pulse lasers can be used to precisely machine virtually anymaterial, including metals, dielectrics, semiconductors and those that are optically transparent, and the process yields no heat affected zone, no mechanical damage, burr-free cuts, and no modifi

* information listed above is at the time of submission.

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