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Advanced Manufacturing and Material Measurements Software Tool Weave ™ for the Acceleration and Automation of SEM Image Analysis in the Semiconductor Industry

Award Information
Agency: Department of Commerce
Branch: National Institute of Standards and Technology
Contract: 70NANB19H047
Agency Tracking Number: 140-FY19-77
Amount: $99,975.37
Phase: Phase I
Program: SBIR
Solicitation Topic Code: None
Solicitation Number: N/A
Solicitation Year: 2019
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-08-01
Award End Date (Contract End Date): 2020-01-31
Small Business Information
54 Rainey St., Apt. 1121
Austin, TX 78701
United States
DUNS: 058406560
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Meghali Chopra
 (214) 288-7926
Business Contact
 Meghali Chopra
Phone: (214) 288-7926
Research Institution

In this Phase I SBIR proposal, SandBox Semiconductor™ proposes to develop an Advanced Manufacturing and Material Measurements software tool called Weave ™ for accelerating and automating SEM image analysis for the semiconductor industry. During the development of a new manufacturing process line for a semiconductor device, tens of thousands of scanning electron microscopy (SEM) images are taken and measured as feedback to test and optimize the hundreds of processes required to fabricate a given device design. Measurements of critical dimensions (“CDs”) are extracted from these images, for example the top and bottom widths and depths of trenches. Weave ™ will automate the extraction of the CDs from a single or stitched image. This automation will improve accuracy and reduce measurement variability by avoiding human bias, improving data standardization for SEM processing, and accelerating and reducing the cost of process development. The proposed work will leverage innovations in image processing from NIST’s Image Analytics Program as well as SandBox Semiconductor’s process modeling and prediction suite, SandBox Studio™.

* Information listed above is at the time of submission. *

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