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Radiation-Tolerant, High Thermal Conductivity Adhesives for High Energy Physics Detector Applications, Topic 31g

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-SC0019798
Agency Tracking Number: 245195
Amount: $199,956.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 31g
Solicitation Number: DE-FOA-0001941
Solicitation Year: 2019
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-07-01
Award End Date (Contract End Date): 2020-06-30
Small Business Information
2600 Campus Drive, Suite D
Lafayette, CO 80026-3358
United States
DUNS: 161234687
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Andrea Haight
 (303) 664-0394
Business Contact
 Lori Bass
Phone: (303) 664-0394
Research Institution

High Energy Physics experiments utilize highly specialized detector systems that are dimensionally stable and have very low mass to reduce the detected particle scattering. Current detector systems make significant use of adhesives in assembling the components of the system. In order to meet future requirements, radiation-tolerant adhesives with high thermal conductivity are needed; a room temperature thermal conductivity on the order of 4 W/m-K is desired. Composite Technology Development, Inc. (CTD) will explore multiple pathways to increasing the thermal conductivity of resin systems used in composite fabrication and adhesive systems. Primarily, CTD will be focusing on resin systems known for their radiation tolerance (e.g., cyanate ester). High thermal conductivity fillers such as aluminum nitride and graphene will be considered in addition to structured nanoscale materials such as carbon nanotubes. In order to improve the detector’s accuracy, the filler radiation length should be optimized so that particle scattering is minimized. The objective of this Phase I SBIR effort is to develop a radiation tolerant adhesive formulations with high thermal conductivity to specifically address requirements unique to high energy physics detector applications. This objective will be accomplished by evaluating low mass, high thermal conductivity nanoparticle fillers dispersed in radiation-tolerant resins compatible with adhesives applications. Filler selection and loading level will be guided by a combination of thermal conductivity modeling and prediction of system radiation length to minimize particle scattering. Adhesion performance of candidate materials will also be evaluated.This program provides a generalized approach to thermal management in composites and adhesives. Thermally conductive resins are expected to enhance the performance of detectors in high energy physics experiments, ultimately leading to improved particle detection applicable to medical and other advanced imaging applications. Applications are also expected in next- generation, higher field superconducting magnets, based on newer high temperature superconductors (HTS), where quench protection is critical for reducing risk. Additional application areas include the aerospace industry (e.g., satellites, space-based antenna systems) and advanced electronics.

* Information listed above is at the time of submission. *

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