COPPER ELECTROCHEMICAL PLANARIZATION FOR THREE-DIMENSIONAL ADVANCED IC MULTICHIP MODULE AND INTERCONNECT APPLICATIONS

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,907.00
Award Year:
1998
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Award Id:
40916
Agency Tracking Number:
40916
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
315 HULS DR, Clayton, OH, 45315
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
E Jennings Taylor Phd
(937) 836-7749
Business Contact:
() -
Research Institution:
n/a
Abstract
The objective of the program is to develop and commercialize an electrochemical copper planarization process for three-dimensional advanced IC applications (multichip modules and interconnects) based on a modulated reverse electrochemical planarization (MREF-ECP) process. The Phase I program will demonstrate the MREF-ECP process using damascene architecture with trenches of 1 to 0.25 microns and aspect ratios of 1:1 to 3:1. These dimensional features are not currently attained using state-of-the art fabrication techniques. Further, the proposed MREF-ECP process will (1) improve through-put due to the elimination of the time consuming electropolishing step, (2) reduce capital investment with less processing sequences, and (3) minimize or eliminate the waste stream volume. The proposed MREF-ECP process is a key enabling technology for three-dimensional IC applications required by the U.S. Air Force to reduce the power, weight, volume, and cost of aircraft microelectronics.

* information listed above is at the time of submission.

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