Electrically Medicated Microetching Manufacturing Process to Replace Emersion and Spray Etching

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-02ER83425
Agency Tracking Number: 70349S02-II
Amount: $749,919.00
Phase: Phase II
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Faraday Technology, Inc.
35 Huls Drive, Clayton, OH, 45315
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jenny Sun
 (937) 836-7749
Business Contact
 E. Jennings Taylor
Phone: (937) 836-7749
Email: jenningstaylor@faradaytechnol
Research Institution
70349S02-II This project will develop an electrically mediated etching technology to replace immersion and spray etching techniques used in the manufacture of large (2m x 2m to 5m x 5m), thin (100-200 mm thick), multiple-layer printed circuit boards of interest to the Department of Energy high energy physics program. Lines and spaces with dimensions down to 10 mm will be consistently etched to provide a cost-effective solution for improved electronics module designs. This approach will be compatible with commercial printed circuit-board-fabrication facilities. Phase I demonstrated that in a neutral salt electrolyte, the process met or exceeded desired performance criteria for etching small lines and spaces in a printed circuit board. The results exceeded those obtained by spray or DC etching. Phase II will further develop a mathematical model of the electrically mediated etching process and use it to develop and optimize an electrically mediated waveform library for a wide range of feature sizes. A pilot-scale Alpha test facility will be designed and developed for the fabrication of large printed circuit boards. The etching of full-size panels will be performed using that facility. Commercial Applications and Other Benefits as described by awardee: Today, microetched products with physical attributes below 75 mm experience low process yields (approx 70%). A process capable of etching lines and spaces down to 10 mm would increase yields, lower manufacturing costs, reduce material and utility consumption, reduce costs to the OEM, and provide a technology advancement that would allow higher density packaging at the printed circuit board level.

* information listed above is at the time of submission.

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