SBIR Phase I: Microfluidics Device for Real-time Process Control of Copper Plating Baths

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$100,000.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
0538736
Agency Tracking Number:
0538736
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Faraday Technology Inc
315 Huls Drive, Clayton, OH, 45315
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Holly Garich
Ms
(937) 836-7749
hollygarich@faradaytechnology.com
Business Contact:
E Jennings Taylor
Dr
(937) 836-7749
jenningstaylor@faradaytechnology.com
Research Institution:
n/a
Abstract
This Small Business Innovation Research Phase I project will demonstrate the technical and economic feasibility of a novel electrochemical sensor based on the principles of microfluidics and alternating current voltammetry as a powerful tool to monitor the constituents of semiconductor and printed wiring board plating baths. Currently, these industries rely on technologies such as cyclic voltammetry stripping and pulsed cyclic galvanostatic analysis to monitor these species, but both methods have associated drawbacks, such as large required footprint, high operation costs, poor system reliability, reduced system availability, and issues with daily tool-to-tool process stability. The proposed technology is anticipated to circumvent these limitations by utilizing mini sampling probes to collect and electrochemically measure the concentration of plating bath constituents, which results in a highly-selective, cost efficient sensor that is applicable for on-line, real-time monitoring of plating bath composition. In the semiconductor industry, it is critical to continually enhance technology in order to stay competitive. The proposed technology allows a high value enhancement to copper plating of semiconductors and printed wiring boards. The proposed technology will provide a highly-selective monitoring tool. This will allow semiconductor and printed wiring board manufacturers a higher level of bath control, which will result in a higher quality product and less waste associated with the actual semiconductors and PWBs.

* information listed above is at the time of submission.

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