STTR Phase I: Thermally-Assisted Electro-Etching of Electronics Packages

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$150,000.00
Award Year:
2007
Program:
STTR
Phase:
Phase I
Contract:
0711332
Award Id:
84908
Agency Tracking Number:
0711332
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
315 HULS, 6745 HOLLISTER AVENUE, Clayton, OH, 45315
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
793274747
Principal Investigator:
Heather McCrabb
Ms
(937) 836-7749
heathermccrabb@faradaytechnology.com
Business Contact:
E Jennings Taylor
PhD
(937) 836-7749
jenningstaylor@faradaytechnology.com
Research Institution:
Columbia University
Alan J West
2960 Broadway
New York, NY, 10027 6902
(212) 854-4452
Nonprofit college or university
Abstract
This Small Business Technology Transfer (STTR) Phase I project addresses an enabling technology for fabrication of printed circuit boards and electronic packages. The demand for increased integrated circuit density, performance and reliability while reducing size, weight and cost of electronic modules requires interconnects and packaging to employ lines and spaces that are less than 75 micron in width. Through-mask chemical etching of interconnects isotropically attacks copper under the mask, limiting feature sizes to larger than 75 micron. The proposed innovation, Thermally-Assisted Electro-Etching, combines Faradayic electrochemical etching to generate an anisotropic current distribution through the mask, with a pulsed thermal source to enhance anisotropic etching by selective heating of the exposed copper. Unlike chemical etching, this technology will enable through-mask etching of features 25 - 30 micron in width. The Phase I project will demonstrate this technology through design and build of an apparatus that promotes controlled etching, electrolyte selection, optimization of electrochemical and thermal process parameters, and an economic evaluation of the technology. The anticipated result is a robust, anisotropic, cost-effective through-mask etching process for electronic packaging features below 75 micron. The project team, Faraday, Columbia University and Lockheed-Martin, will set the stage for technology validation and commercialization.The research project, if successful, will result in higher density, lower cost interconnect applications. The proposed technological innovation is benign and will not adversely impact the environment nor worker safety. Workforce development with Columbia undergraduate and graduate students is anticipated and Faraday routinely provides opportunities for local undergraduate students and high school teachers in conjunction with NSF's REU and RET programs, respectively.

* information listed above is at the time of submission.

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