Electrically Mediated Deposition of Niobium for Coating Copper Elliptical Cavities

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$99,995.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-09ER85382
Agency Tracking Number:
91290
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Faraday Technology, Inc.
315 Huls Drive, Clayton, OH, 45315
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
793274747
Principal Investigator:
Heather McCrabb
Ms.
(937) 836-7749
heathermccrabb@faradaytechnology.com
Business Contact:
Jennings Taylor
Dr.
(937) 836-7749
jenningstaylor@faradaytechnology.com
Research Institution:
n/a
Abstract
To improve the superconducting components of radio frequency devices used in particle accelerators, there is a need to develop techniques to create a layer of niobium on the interior of a copper elliptical cavity. This project will develop an electrically-mediated electro-deposition process to deposit niobium onto copper elliptical cavities from a room temperature ionic liquid plating bath. Electrical mediation will enhance the electro-deposition process through the control of additional process parameters. In Phase I, a small copper substrate will be coated with niobium and the thickness, uniformity, adhesion, and microstructure of the deposit will be evaluated. In Phase II, a layer of niobium will be deposited onto the interior surface of a copper elliptical cavity, and the performance of the cavity will be evaluated in radio frequency devices. Commercial Applications and other Benefits as described by the awardee An electrically-mediated electro-deposition process would be a simpler, and less expensive method for depositing high purity niobium coatings on superconducting radio frequency cavities. Areas of interest include both the energy and national security industries. Additionally, niobium is a biocompatible material, making niobium coatings a candidate for surgical implants.

* information listed above is at the time of submission.

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