Electrically Mediated Deposition of Niobium for Coating Copper Elliptical Cavities

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-09ER85382
Agency Tracking Number: 91290
Amount: $99,995.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: 46 a
Solicitation Number: DE-PS02-08ER08-34
Small Business Information
315 Huls Drive, Clayton, OH, 45315
DUNS: 793274747
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Heather McCrabb
 (937) 836-7749
Business Contact
 Jennings Taylor
Title: Dr.
Phone: (937) 836-7749
Email: jenningstaylor@faradaytechnology.com
Research Institution
To improve the superconducting components of radio frequency devices used in particle accelerators, there is a need to develop techniques to create a layer of niobium on the interior of a copper elliptical cavity. This project will develop an electrically-mediated electro-deposition process to deposit niobium onto copper elliptical cavities from a room temperature ionic liquid plating bath. Electrical mediation will enhance the electro-deposition process through the control of additional process parameters. In Phase I, a small copper substrate will be coated with niobium and the thickness, uniformity, adhesion, and microstructure of the deposit will be evaluated. In Phase II, a layer of niobium will be deposited onto the interior surface of a copper elliptical cavity, and the performance of the cavity will be evaluated in radio frequency devices. Commercial Applications and other Benefits as described by the awardee An electrically-mediated electro-deposition process would be a simpler, and less expensive method for depositing high purity niobium coatings on superconducting radio frequency cavities. Areas of interest include both the energy and national security industries. Additionally, niobium is a biocompatible material, making niobium coatings a candidate for surgical implants.

* Information listed above is at the time of submission. *

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