Improved inspection of Bonded Repairs

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8501-07-M-0138
Agency Tracking Number: F071-325-0339
Amount: $94,006.00
Phase: Phase I
Program: SBIR
Awards Year: 2007
Solicitation Year: 2007
Solicitation Topic Code: AF071-325
Solicitation Number: 2007.1
Small Business Information
143 Hawbaker Industrial Drive Suite #102, State College, PA, 16803
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Joseph Rose
 Applications Engineer
 (814) 234-3437
Business Contact
 Michael Avioli
Title: Applications Engineer
Phone: (814) 234-3437
Research Institution
Bonded joints are used extensively for both civilian and military aircraft applications, especially for corrosion damage mitigation via patch bonding. Assessing the quality of these bonds is typically performed using NDE techniques such as bulk wave ultrasonics or thermography. These methods cannot reliably differentiate between a good bond and a so-called “kissing” bond. A kissing bond has no mechanical integrity existing between one or both of the substrates that sandwich the adhesive. Shear wave energy concentrated at the substrate-adhesive interfaces will certainly provide the necessary kissing bond detection capability. Bulk wave techniques could be designed to introduce shear waves into a bond structure but they would be impractical and tedious to implement. Guided waves, on the other hand, provide the resource to easily introduce shear waves into the bond interfaces. FBS, Inc. proposes the development of a guided wave technology that will be capable of determining the mechanical integrity and strength of bonded structures to solve the famous “kissing” bond problem. The guided wave technique, which has shown promise in previous work, will take advantage of recent advances in guided wave sensor technology and feature based detection algorithms to finally provide a solution to the “kissing” bond problem.

* Information listed above is at the time of submission. *

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